TSMC's System-on-Wafer Platform Goes 3D: CoW-SoW Stacks Up the Chips

TSMC has been offering its System-on-Wafer integration technology, InFO-SoW, since 2020. For now, only Cerebras and Tesla have developed wafer scale processor designs using it, as while they have...

2 by Anton Shilov on 4/26/2024

TSMC Preps Cheaper 4nm N4C Process For 2025, Aiming For 8.5% Cost Reduction

While the bulk of attention on TSMC is aimed at its leading-edge nodes, such as N3E and N2, loads of chips will continue to be made using more mature...

5 by Anton Shilov on 4/25/2024

TSMC 2nm Update: N2 In 2025, N2P Loses Backside Power, and NanoFlex Brings Optimal Cells

Taiwan Semiconductor Manufacturing Co. provided several important updates about its upcoming process technologies at its North American Technology Symposium 2024. At a high level, TSMC's 2 nm plans remain...

0 by Anton Shilov on 4/25/2024

TSMC's 1.6nm Technology Announced for Late 2026: A16 with "Super Power Rail" Backside Power

With the arrival of spring comes showers, flowers, and in the technology industry, TSMC's annual technology symposium series. With customers spread all around the world, the Taiwanese pure play...

18 by Anton Shilov on 4/25/2024

Report: Seagate, Western Digital Hike HDD Prices Amid Surge In Demand

Seagate Technology has reportedly notified its customers abouts its plans to raise prices on new hard drive orders and for demands that exceed prior agreements, echoing a similar move...

11 by Anton Shilov on 4/24/2024

Seagate: Mozaic 3+ HAMR Hard Drives Can Last Over Seven Years

As Seagate ramps up shipments of its new heat assisted magnetic recording (HAMR)-based Mozaic 3+ hard drive platform, the company is both in the enviable position of shipping the...

13 by Anton Shilov on 4/23/2024

Samsung Starts Mass Production of 9th Generation V-NAND: 1Tb 3D TLC NAND

Samsung Electronics has started mass production of its 9th generation of V-NAND memory. The first dies based on their latest NAND tech come in a 1 Tb capacity using...

2 by Anton Shilov on 4/23/2024

JEDEC Extends DDR5 Memory Specification to 8800 MT/s, Adds Anti-Rowhammer Features

When JEDEC released its DDR5 specification (JESD79) back in 2020, the standard setting organization defined precise specs for modules with speed bins of up to 6400 MT/s, while leaving...

14 by Anton Shilov on 4/22/2024

SK Hynix and TSMC Team Up for HBM4 Development

SK hynix and TSMC announced early on Friday that they had signed a memorandum of understanding to collaborate on developing the next-generation HBM4 memory and advanced packaging technology. The...

5 by Anton Shilov on 4/19/2024

TSMC Posts Q1'24 Results: 3nm Revenue Share Drops Steeply, but HPC Share Rises

Taiwan Semiconductor Manufacturing Co. this week released its financial results for Q1 2024. Due to a rebound in demand for semiconductors, the company garned $18.87 billion in revenue for...

11 by Anton Shilov on 4/19/2024

ASML Patterns First Wafer Using High-NA EUV Tool, Ships Second High-NA Scanner

This week ASML is making two very important announcements related to their progress with high numerical aperature extreme ultraviolet lithography (High-NA EUV). First up, the company's High-NA EUV prototype...

13 by Anton Shilov on 4/18/2024

Samsung Unveils 10.7Gbps LPDDR5X Memory - The Fastest Yet

Samsung today has announced that they have developed an even faster generation of LPDDR5X memory that is set to top out at LPDDR5X-10700 speeds. The updated memory is slated...

6 by Anton Shilov on 4/17/2024

Samsung To Receive $6.4 Billion Under CHIPS Act to Build $40 Billion Fab in Texas

Samsung Electronics this week was awarded up to $6.4 billion from the U.S. government under the CHIPS and Science Act to build its new fab complex in Taylor, Texas...

5 by Anton Shilov on 4/16/2024

Corsair Enters Workstation Memory Market with WS Series XMP/EXPO DDR5 RDIMMs

Corsair has introduced a family of registered memory modules with ECC that are designed for AMD's Ryzen Threadripper 7000 and Intel's Xeon W-2400/3400-series processors. The new Corsair WS DDR5...

9 by Anton Shilov on 4/12/2024

Western Digital Previews 4 TB SD Card: World's Highest-Capacity

Western Digital this week is previewing the industry's first 4 TB SD card. The device is being showcased at the NAB trade show for broadcasters and content creators and...

15 by Anton Shilov on 4/11/2024

Intel To Discontinue Boxed 13th Gen Core CPUs for Enthusiasts

In an unexpected move, Intel has announced plans to phase out the boxed versions of its enthusiasts-class 13th Generation Core 'Raptor Lake' processors. According to a product change notification...

5 by Anton Shilov on 4/10/2024

Report: Impact of Taiwanese Earthquake on DRAM Output to be Negligible in Q2

Following the magnitude 7.2 earthquake that struck Taiwan on April 3, 2024, there was immediate concern over what impact this could have on chip production within the country. Even...

2 by Anton Shilov on 4/10/2024

Google Develops In-House Arm 'Axion' CPU for Datacenters

Google was among the first hyperscalers build custom silicon for its services, starting first with tensor processing units (TPUs) for its AI initiatives, and then video transcoding units (VCUs...

15 by Anton Shilov on 4/9/2024

TSMC to Receive $6.6B Under US CHIPS Act, Set to Build 2nm Fab in Arizona

TSMC has entered into a preliminary agreement with the U.S. Department of Commerce, securing up to $6.6 billion in direct funding and access to up to $5 billion in...

23 by Anton Shilov on 4/8/2024

SK hynix to Build $3.87 Billion Memory Packaging Fab in the U.S. for HBM4 and Beyond

SK hynix this week announced plans to build its advanced memory packaging facility in West Lafayette, Indiana. The move can be considered as a milestone both for the memory...

7 by Anton Shilov on 4/5/2024

Log in

Don't have an account? Sign up now