DRAM

G.Skill on Tuesday introduced its ultra-low-latency DDR5-6400 memory modules that feature a CAS latency of 30 clocks, which appears to be the industry's most aggressive timings yet for DDR5-6400 sticks. The modules will be available for both AMD and Intel CPU-based systems. With every new generation of DDR memory comes an increase in data transfer rates and an extension of relative latencies. While for the vast majority of applications, the increased bandwidth offsets the performance impact of higher timings, there are applications that favor low latencies. However, shrinking latencies is sometimes harder than increasing data transfer rates, which is why low-latency modules are rare. Nonetheless, G.Skill has apparently managed to cherry-pick enough DDR5 memory chips and build appropriate printed circuit boards to produce DDR5-6400 modules with...

Samsung Becomes Latest Memory Fab to Cut Production Amidst Post-Pandemic Slump

Following an ongoing slump in demand that has impacted the entire memory industry over the last several months, Samsung this week has become the latest memory foundry to announce...

11 by Anton Shilov on 4/7/2023

Kingston Launches Fury Beast And Fury Renegade DDR5 Memory in White

Kingston Fury, the gaming and high-performance division of Kingston Technology Company, Inc., has expanded the aesthetics of the company's Fury DDR5 memory portfolio. The Fury Beast and Fury Renegade...

17 by Zhiye Liu on 3/28/2023

SK hynix Intros LPDDR5T Memory: Low Power RAM at up to 9.6Gbps

In a bit of a surprise move, SK hynix this week has announced a new variation of LPDDR5 memory technology, which they are calling LPDDR5T. Low Power Double Data...

10 by Ryan Smith on 1/25/2023

Micron Announces 20-Year Plan To Build $100 Billion U.S. Fab Complex

Now that the U.S. government has finally settled the matter of whether it would be providing subsidies to entice chip fabs to setup shop within the U.S., those fabs...

48 by Anton Shilov on 10/10/2022

Micron Breaks Ground on Its $15 Billion EUV DRAM Fab in the U.S.

Micron this week broke ground on its leading-edge memory production facility near Boise, Idaho. The company will invest $15 billion in its new fab as a part of its...

23 by Anton Shilov on 9/14/2022

Samsung's $15 Billion R&D Complex to Overcome Limits of Semiconductor Scaling

Samsung on Friday broke ground for a new semiconductor research and development complex which will design new fabrication processes for memory and logic, as well as conduct fundamental research...

26 by Anton Shilov on 8/19/2022

Crucial Ballistix Memory Goes End-of-Life, Micron Realigns its DRAM Strategy

Underscoring the fast-paced nature of the computer hardware market, Micron this week has decided to discontinue all of its current Crucial Ballistix memory products. The move to end-of-life (EOL...

13 by Gavin Bonshor on 2/17/2022

ASUS Demonstrates DDR5 to DDR4 Converter Card

One of the key issues with purchasing a modern Alder Lake system today is the cost of the memory, especially when an enthusiast wants to use DDR5. Due to...

31 by Dr. Ian Cutress on 12/30/2021

SK Hynix to Manufacture 48 GiB and 96 GiB DDR5 Modules

Today SK Hynix is announcing the sampling of its next generation DDR5 memory. The headline is the commercialization of a new 24 gigabit die, offering 50% more capacity than...

22 by Dr. Ian Cutress on 12/14/2021

Samsung Announces First LPDDR5X at 8.5Gbps

After the publication of the LPDDR5X memory standard earlier this summer, Samsung has now been the first vendor to announce new modules based on the new technology. The LPDDR5X standard...

19 by Andrei Frumusanu on 11/9/2021

SK Hynix Announces Its First HBM3 Memory: 24GB Stacks, Clocked at up to 6.4Gbps

Though the formal specification has yet to be ratified by JEDEC, the memory industry as a whole is already gearing up for the upcoming launch of the next generation...

19 by Ryan Smith on 10/20/2021

Samsung Teases 512 GB DDR5-7200 Modules

This week as part of the annual Hot Chips semiconductor conference, Samsung’s memory division has presented a poster/slides on a project it is currently working on with impressive end-point...

27 by Dr. Ian Cutress on 8/22/2021

JEDEC Publishes LPDDR5X Standard at up to 8533 Mbps

JEDEC and the JC-42.6 Subcommittee for Low Power Memories has announced the publication of the new JESD209-5B standard which now includes improvements to LPDDR5, as well as an extension...

17 by Andrei Frumusanu on 7/29/2021

Computex 2021: G.Skill Trident Z Royal Elite With DDR4-4000 CL14, Tight Latencies

During Computex 2021, G.Skill has announced a couple of new memory kits featuring its regal-looking Trident Z Royal Elite heatsinks. Available with super tight primary latencies of CL14, the...

29 by Gavin Bonshor on 6/8/2021

Computex 2021: TeamGroup Announces its First DDR5-4800 Memory Module

Back in December 2020, TeamGroup announced its intentions for the switch to DDR5 memory on future platforms. During Computex 2021, TeamGroup claims it has 'successfully taken the lead over...

12 by Gavin Bonshor on 6/7/2021

After Selling HyperX to HP, Kingston Resurrects FURY Brand for DRAM and SSDs

Last week, we reported that the highly anticipated acquisition of Kingston's HyperX gaming brand by HP was completed for the sum of $325 million. As we noted, the terms...

9 by Gavin Bonshor on 6/7/2021

Using a PCIe Slot to Install DRAM: New Samsung CXL.mem Expansion Module

In the computing industry, we’ve lived with PCIe as a standard for a long time. It is used to add any additional features to a system: graphics, storage, USB...

47 by Dr. Ian Cutress on 5/11/2021

SK Hynix to Build $106 Billion Fab Cluster: 800,000 Wafer Starts a Month

Capping off a busy week for fab-related news, South Korea authorities this week gave SK Hynix a green light to build a new, 120 trillion won ($106.35 billion) fab...

41 by Anton Shilov on 4/2/2021

Intel’s DPG Launch Event April 6th: Early Look at 3rd Gen Xeon Scalable (Ice Lake)

Today Intel has announced that it will be holding a launch event on April 6th for the new vision of its Data Platform Group. This event is set to...

29 by Dr. Ian Cutress on 3/19/2021

TeamGroup Announces Intentions for DDR5, ELITE DDR5-5200 in 2021

Earlier in the year, we learned that a lot of DDR5 manufacturing is already in the pipeline, with Samsung, SK Hynix, and Micron all making announcements this year regarding...

19 by Gavin Bonshor on 12/1/2020

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