Memory
The CXL consortium has had a regular presence at FMS (which rechristened itself from 'Flash Memory Summit' to the 'Future of Memory and Storage' this year). Back at FMS 2022, the company had announced v3.0 of the CXL specifications. This was followed by CXL 3.1's introduction at Supercomputing 2023. Having started off as a host to device interconnect standard, it had slowly subsumed other competing standards such as OpenCAPI and Gen-Z. As a result, the specifications started to encompass a wide variety of use-cases by building a protocol on top of the the ubiquitous PCIe expansion bus. The CXL consortium comprises of heavyweights such as AMD and Intel, as well as a large number of startup companies attempting to play in different segments on...
Samsung Develops 12-Layer 3D TSV DRAM: Up to 24 GB HBM2
Samsung on Monday said that it had developed the industry’s first 12-layer 3D packaging for DRAM products. The technology uses through silicon vias (TSVs) to create high-capacity HBM memory...
11 by Anton Shilov on 10/7/2019
Gen-Z PHY Specification 1.1 Published: Adds PCIe 5.0, Gen-Z 50G Fabric
The Gen-Z Consortium this week released Physical Layer Specification 1.1 for Gen-Z interconnects. The new standard adds enhanced support for PCIe Gen 5 as well as Gen-Z 50G Fabric...
8 by Anton Shilov on 10/4/2019
Micron: 128-Layer 4th 3D NAND with RG Architecture Coming Soon
Micron has taped out its first 4th Generation 3D NAND memory devices with its new replacement gate (RG) architecture. The tape out confirms that the company is on track...
10 by Anton Shilov on 10/4/2019
Corsair Reveals Vengeance LPX DDR4-4866 Memory Kit
Corsair on Thursday released its fastest memory kit to date, the Vengeance LPX DDR4-4866, aimed at the most performance-hungry enthusiasts. The modules are specifically tested for compatibility AMD’s Ryzen...
12 by Anton Shilov on 9/13/2019
YMTC Starts Volume Production of 64-Layer 3D NAND
Yangtze Memory Technologies Co. (YMTC) this week said that it had started volume production of its 64-layer 3D NAND memory that uses its proprietary Xtacking architecture. The bhips were...
4 by Anton Shilov on 9/5/2019
Hot Chips 31 Analysis: In-Memory Processing by UPMEM
One of the key critical future elements about this world of compute is moving data about. Moving data requires power, to the point where calling data from memory can...
38 by Dr. Ian Cutress on 8/19/2019
Micron’s Fab 10 Expansion Completed: 96-Layer 3D NAND Production Starts in 2019
Micron this week hosted a grand opening ceremony of its Fab 10 Expansion in Singapore. The new cleanroom is not expected to increase the company’s production capacity in terms...
21 by Anton Shilov on 8/16/2019
Micron: Mass Production of 16 Gb DDR4 & LPDDR4X Chips Using 1z nm Technology
Micron announced on Thursday that it had started volume production of memory chips using its 3rd Generation 10 nm-class fabrication technology (also known as 1Z nm). The first DRAMs...
25 by Anton Shilov on 8/16/2019
SMART Modular Shows Off 256 GB Gen-Z Memory Module
SMART Modular this month demonstrated one of the industry’s first prototypes of a EDSFF 3-inch DDR4 Gen-Z memory module. The ZMM supports advanced functionality enabled by the new interface...
15 by Anton Shilov on 8/15/2019
SK Hynix Announces 3.6 Gbps HBM2E Memory For 2020: 1.8 TB/sec For Next-Gen Accelerators
SK Hynix this morning has thrown their hat into the ring as the second company to announce memory based on the HBM2E standard. While the company isn’t using any...
23 by Ryan Smith on 8/12/2019
Japan’s Ministry Approves Shipments of Industrial Chemicals to South Korea
Amidst the ongoing trade conflict between Japan and South Korea, there is some good news to close the week out. The Japanese Ministry of Economy, Trade and Industry has...
16 by Anton Shilov on 8/9/2019
Microchip Announces DRAM Controller For OpenCAPI Memory Interface
Microchip's subsidiary Microsemi is entering a new market with the introduction of the SMC 1000 8x25G Serial Memory Controller. This is a DDR4 DRAM controller that connects to host...
17 by Billy Tallis on 8/5/2019
Western Digital: Nearly All NAND Capacities Resumed Normal Operations
Western Digital and its manufacturing partner Toshiba Memory Co. (TMC) had managed to resume normal operation of almost all of their joint production lines at their Yokkaichi Operations campus...
31 by Anton Shilov on 8/1/2019
G.Skill Reveals Trident Z Neo DDR4-3800 CL14 Kit for AMD Ryzen 3000
G.Skill has introduced its new high-end Trident Z Neo memory kits for systems based on AMD’s latest Ryzen 3000 processors. According to G.Skill, its Trident Z Neo DDR4-3800 CL14...
10 by Anton Shilov on 8/1/2019
Thermaltake’s Launches Liquid-Cooled WaterRam RGB DDR4-3600 Kits
Seemingly intent on proving that everything in a PC should in fact be liquid cooled, Thermaltake this week has expanded its WaterRAM lineup of water-cooled RAM with DDR4-3600 kits. Available...
18 by Anton Shilov on 8/1/2019
32 GB Unbuffered DIMMs Listed from Ten Brands: DDR4-2400 to DDR4-4000
Now that both Samsung and Micron are shipping their 16 Gb DDR4 memory chips to third parties, we're seeing wider availability of 32 GB unbuffered memory modules (UDIMMs). To...
12 by Anton Shilov on 7/31/2019
SK Hynix NAND Update: 3D NAND Output Cut, Slowdown Capacity Expansions
SK Hynix said that it would cut wafer starts of 3D NAND in the coming months more aggressively than it originally anticipated earlier this year. Besides, the company will...
14 by Anton Shilov on 7/26/2019
LG Display & SK Hynix Looking to Diversify Industrial Suppliers as Row with Japan Intensifies
South Korean electronics companies reaffirmed this week that production of computer memory and displays could be disrupted because of ongoing trade dispute between the country and Japan. Both SK...
8 by Anton Shilov on 7/26/2019
Corsair Unveils 32 GB Vengeance LPX DDR4 DIMMs, 64 GB & 128 GB Dual-Channel Kits
Corsair has introduced its first 32 GB unbuffered DRAM modules along with 64 GB and 128 GB dual-channel memory kits for mainstream PC platforms based on AMD’s 400/500-series as...
19 by Anton Shilov on 7/19/2019
Samsung Starts Production of LPDDR5-5500 Devices: 12 GB of DRAM in a Smartphone
Samsung has kicked off volume production of its LPDDR5 memory devices and intends to start mass assembly of memory packages based on the new DRAMs. The company’s LPDDR5 memory...
15 by Anton Shilov on 7/18/2019
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